THERMAL ARCHITECTURE CATALOGUE

Cooling System Architectures

Modular, high-performance thermal architectures engineered specifically for zero-downtime data centers, high-density compute racks, and mission-critical telecommunications facilities.

ARCH-DTC-01|2N Concurrent
1.08 PUE
HydroChassis Direct-to-Chip Manifold
ΔT 18°CUp to 120 kW/rack
Ultra-High Density Heat Dissipation for AI & HPC Clusters
HydroChassis Direct-to-Chip Manifold
Closed-loop micro-channel cold plate architecture providing direct dielectric fluid distribution to high-TDP processor sockets and accelerator blades.
Coolant Type
PG-25 Engineered Liquid
Manifold Metallurgy
Nickel-Plated C11000 Copper
Telemetry Protocol
Modbus TCP / SNMPv3
Safety Standard
Dual Dry-Break Couplings

Guaranteed Uptime & SLA Compliance
ARCH-DTC-02|N+1 Redundant
1.04 PUE
Immersion Tank Secondary Loop System
ΔT 24°CUp to 180 kW/tank
Modular Single-Phase Immersion for Extreme Thermal Loads
Immersion Tank Secondary Loop System
Fully sealed hydrocarbon bath containment paired with integrated plate heat exchangers for total component submersion and noise-free operation.
Dielectric Fluid
Single-Phase Synthetic Hydrocarbon
Tank Construction
316L Surgical Stainless Steel
Pumping Redundancy
Dual EC Variable Mag-Drive
Thermal Capacity
250 kW Thermal Rejection

Guaranteed Uptime & SLA Compliance
Total System Redundancy
N+1 to 2N Concurrent

No single point of failure in cooling distribution

Peak Power Efficiency
Sub-1.10 Design PUE

Validated thermal modeling across variable loads

High-Density Capability
180 kW / Footprint

Accelerated AI clusters & high-TDP compute racks

Custom architecture requirement?
Thermal Architecture Matrix

Mission-Critical Cooling Methodology Comparison

Evaluate thermal management strategies across power density, thermodynamic efficiency, and facility footprints. Compare fluid and aerodynamic dissipation mechanisms for zero-downtime operations.

Real-Time Benchmarks Verified
Request Facility Audit
Showing 5 Architectural Profiles
Cooling Architecture
PUE Index
Heat Density
Specifications
Direct-to-Chip Liquid Cooling (DLC)
High-Density Liquid
1.08 – 1.14Operational Baseline
40 – 120 kW/rack

Thermodynamic Specifications

Coolant Medium:Deionized Water / Glycol loop
Inlet Temp Range:32°C – 45°C (Warm water supply)
Facility Footprint:Minimal (Integrated)
Retrofit Ease:Moderate (Standard rack envelope)

Optimized Workload Application

AI/ML training clusters, GPU nodes, high-frequency compute

Engineered for zero thermal throttling during sustained peak compute loads.

Engineering Trade-Off Analysis

Requires CDU manifolds and server blade cold-plate retrofits

Design Architecture Loop
Single/Two-Phase Immersion Cooling
High-Density Liquid
1.02 – 1.06Operational Baseline
80 – 250+ kW/rack
In-Row Precision CRAH Systems
Row-Level Precision
1.20 – 1.30Operational Baseline
15 – 35 kW/rack
Rear-Door Heat Exchangers (RDHx)
Row-Level Precision
1.12 – 1.18Operational Baseline
25 – 65 kW/rack
Perimeter CRAC / CRAH Air Handlers
Perimeter Air
1.35 – 1.55Operational Baseline
5 – 12 kW/rack
Hybrid Topology Integration
Combining direct-to-chip loops with existing CRAH infrastructure for phased AI migration.
Enables up to 60% PUE reduction without full facility floor redesign.
Continuous Fluid Telemetry
Real-time pressure differential, pH, and dielectric purity monitoring across loops.
Redundant sensors prevent micro-cavitation and thermal runaway risks.
Turnkey Engineering Deployment
From CFD aerodynamic modeling to modular manifold fabrication and commissioning.
Full SLA guarantees backing 99.999% environmental uptime.

Need a Custom Thermal Load Calculation for Your Hall?

Our engineering team analyzes CFD airflows, CDU sizing, and kW/rack threshold requirements for your infrastructure.

Consult Thermal Engineers
Telemetry Active: NOC Online• 24/7/365 Monitor

Thermal dissipation systems operating at continuous nominal parameters across all managed nodes.

Technology infrastructure company engineering high-performance cooling architectures for data centers, telecommunications hubs, industrial electronics, and critical computing facilities.

Zero Unscheduled Thermal Downtime
Mission-Critical Redundancy Standards

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Deployment Architectures

Spec Sheet v4.2
Data Center CRAH / CRAC Matrix2N+1
Tier IV Certified1.12 Design PUE
High-Density Liquid Immersion2N Loop
Direct-to-Chip 100kW+0.00% Vapor Loss
Telecom Facility Glycol LoopsN+1 Active
Sub-Station Hardened-40°C to +55°C Ops
Industrial Cleanroom ClimateN+1 Backup
ISO Class 4/5 Rated±0.2°C Precision
Engineered Verification Standards:
ASHRAE TC 9.9 Compliant
ISO 9001:2015 Registered
UL / CE Listed Hardware
Zero-Downtime SLA Guarantee

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